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Molybdenum
Technical Data Sheet
| Chemical Composition Limits | ||||||||||
| Weight% | Mo | K | Al | Si | Fe | Ni | Cu | Cr | Na | W |
| Molybdenum | 99.9% min | 0.0007 | 0.0005 | 0.0050 | 0.0040 | 0.0030 | 0.0001 | 0.0001 | 0.0001 | 0.0020 |
| Molybdenum Typical Properties | |||
| Atomic Weight | 95.94 | ||
| Density | 10.14 gm/cm3 | ||
| Melting point | 2610+/- 10°C | Thermal Conductivity | |
| Recrystallization | 20°C | 0.34 cal/cm/s/C | |
| Temperature (100%) | 1000°C | 0.25 cal/cm/s/C | |
| Recrystallization 1000 to 1100°C | 1500°C | 0.22 cal/cm/s/C | |
| 2200°C | 0.17 cal/cm/s/C | ||
| Transition Point | |||
| Brittle/Ductile | -100 to 100 °C | Specific Heat | |
| 20°C | 6.2 X 10-2 cal/gm/C | ||
| Vapor Pressure | 1000°C | 7.4 X 10-2 cal/gm/C | |
| 1500C | 6.4 x 10-9 mm Hg | 2000°C | 10.0 x 10-2 cal/gm/C |
| 2000C | 4.0 x 10-5 mm Hg | ||
| 2500 C | 1.0 X 10-2 mm Hg | Restivity | |
| 20C | 5.3 x 10-6 ohm-cm | ||
| 1000C | 3.2 x 10-5 ohm-cm | ||
| 2000C | 6.1 x 10-5 ohm-cm | ||
| Coefficient of linear expansion | |||
| 20 | 5.3 X 10-6 C-1 | Temperature Cofefficient | |
| 20-1000C | 5.8 X 10-6 C-1 | (20-100 C) | 4.5 X 10-3 C-1 |
| 20-1500 | 6.5 X 10-6 C-1 | Hardness | |
| Tensile Strength | Sheet | 220-240 DPH | |
| Molybdenum Sheet | 50 kpsi-115 kpsi | Rod | 200-220 DPH |
| Molybdenum Rod | 60 kpsi-110 kpsi | Wire | 250-300 DPH |
| Molybdenum Wire | 90 kpsi-350 kpsi | ||
| Yield Strength (0.2% Offset) | |||
| Molybdenum Sheet | 40 kpsi- 95 kpsi | ||
| Molybdenum Rod | 55 kpsi-90 kpsi | ||
| Molybdenum Wire | 75 kpsi- 300 kpsi | ||
| Molybdenum Sheet | Molybdenum Plate | Molybdenum Coil/ Foil | Molybdenum Rod |
| .050 .062 .078 .109 .125 .140 |
.250 .375 .500 .750 1.00 |
.003 .004 .005 .010 .015 .020 .030 .040 .050 .062 |
.125 .250 .312 .437 .500 .625 .750 .875 1.00 1.25 1.50 1.75 2.00 2.25 2.50 3.00 3.50 4.00 |
Availability
For all stock availability contact Sales for availability.
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Disclaimer
Every effort is made to ensure that technical specifications are accurate. However, technical specifications included herein should be used as a guideline only. All specifications are subject to change without notice.
